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Sputter Deposition System
The University is accepting proposals\and intends to enter into an agreement with a vendor that specializes in Sputter Deposition Systems in accordance with the terms and conditions and requirements set forth in this Request for Proposal.
SPUTTERED MATERIALS:
• Ti, Au, Ni, Cr. As Nickel (Ni) is magnetic a special cathode must be used.
• Dielectric materials - SiO2, Si3N4, Ta2O5.
Wafer size: 6 inch
PUMPING SYSTEM: A two-stage, direct-drive mechanical pump and turbo pump evacuate the chamber.
