A MULTISOURCE THERMAL EVAPORATOR WHICH MUST MEET OR EXCEED THE FOLLOWING
MINIMUM SPECIFICATIONS:
A. Two (2) or more deposition sources ______
B. Materials to be deposited: Cds, CdTe, CIGS, Se, SbS, metals ______
C. Substrate Size: 2 x 2, Square ______
D. Max. Film thickness to be deposited: 30um ______
E. Uniformity/thickness specifications/tolerances: 90% +-5% ______
F. Deposition rate and film thickness monitoring ______
G. Batch Size (substrates/run): 4 - 8 ______
H. Throughput (substrates/day): 16 - 32 ______
I. Substrate Rotation ______
J. Multi-Layer Deposition ______
K. Maximum number of layers per substrate (for multi-layer dep.) 4 6 ______
L. Simultaneous co deposition of multiple materials ______
M. Desired orientation (deposit up, down or horizontal): Deposit Up ______
N. Substrate shutter ______
O. Substrate heating to 300 degrees Celsius ______
P. Temperature accuracy: +- 1 degree Celsius ______
Q. Temperature uniformity: +- 5 degrees Celsius ______
R. Substrate cooling to 27 degrees Celsius (room temperature) ______
S. Two (2) spare ports for future sputter sources ______
T. Vacuum load-lock, n2 glove box or simple loading door ______
U. Turbo/Oil sealed mechanical vacuum pumps. If diffusion pump, liquid nitrogen ______
trap is a must.
V. Full Approx. pump down time: 30min ______
W. Ultimate pressure prior to the evaporation: 1E-6 Torr